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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Dual Binary to 1-4 Decoder (Low)
The MC10H171 is a binary coded 2 line to dual 4 line decoder with selected outputs low. With either E0 or E1 high, the corresponding selected 4 outputs are high. The common enable E, when high, forces all outputs high. * Propagation Delay, 2 ns Typical * Power Dissipation 325 mW Typical (same as MECL 10K) * Improved Noise Margin 150 mV (over operating voltage and temperature range) * Voltage Compensated * MECL 10K-Compatible
MC10H171
L SUFFIX CERAMIC PACKAGE CASE 620-10 P SUFFIX PLASTIC PACKAGE CASE 648-08 FN SUFFIX PLCC CASE 775-02
MAXIMUM RATINGS
Characteristic Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current -- Continuous -- Surge Operating Temperature Range Storage Temperature Range -- Plastic -- Ceramic Symbol VEE VI Iout TA Tstg Rating -8 to 0 0 to VEE 50 100 0 to +75 -55 to +150 -55 to +165 Unit Vdc Vdc mA C C B7 A9 E0 14
LOGIC DIAGRAM
10 Q0 3 11 Q0 2 12 Q0 1 13 Q0 0 3 Q1 3 4 Q1 2 E 15 E1 2 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 5 Q1 1 6 Q1 0
ELECTRICAL CHARACTERISTICS (VEE = -5.2 V 5%) (See Note)
0 Characteristic Power Supply Current Input Current High Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage Symbol IE IinH IinL VOH VOL VIH VIL Min -- -- 0.5 -1.02 -1.95 -1.17 -1.95 Max 85 425 -- Min -- -- 0.5 25 Max 77 265 -- Min -- -- 0.3 -0.92 -1.95 -1.07 -1.95 75 Max 85 265 -- -0.735 -1.60 -0.735 -1.45 Unit mA A A Vdc Vdc Vdc Vdc VCC1 0 Characteristic Propagation Delay Data Select Rise Time Fall Time Symbol tpd 0.5 0.5 tr tf 0.5 0.5 2.0 2.6 1.7 1.7 0.5 0.5 0.5 0.5 2.1 2.7 1.8 1.8 0.5 0.5 0.5 0.5 2.2 2.8 1.9 1.9 ns ns Min Max Min 25 Max Min 75 Max Unit ns Q13 Q12 Q11 Q10 B VEE 3 4 5 6 7 8 14 13 12 11 10 9 E0 E1 1 2 16 15
-0.84 -0.98 -0.81 -1.63 -1.95 -1.63 -0.84 -1.13 -0.81 -1.48 -1.95 -1.48
DIP PIN ASSIGNMENT
VCC2 E
AC PARAMETERS
Q00 Q01 Q02 Q03 A
NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through a 50-ohm resistor to -2.0 volts.
Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6-11 of the Motorola MECL Data Book (DL122/D).
3/93
(c) Motorola, Inc. 1996
2-9
REV 5
MC10H171
TRUTH TABLE
Enable Inputs E L L L L L L H E0 L L L L L H X E1 L L L L H L X A L L H H L L X Inputs B L H L H L L X Q10 L H H H H L H Q11 H L H H H H H Q12 H H L H H H H Outputs Q13 H H H L H H H Q00 L H H H L H H Q01 H L H H H H H Q02 H H L H H H H Q03 H H H L H H H
MOTOROLA
2-10
MECL Data DL122 -- Rev 6
MC10H171
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 775-02 ISSUE C
B -N- Y BRK D -L- -M- W D Z
0.007 (0.180) M T L-M U
S
N
S S
0.007 (0.180) M T L-M
N
S
20
1
X V VIEW D-D
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R
0.007 (0.180) M T L-M 0.007 (0.180) M T L-M
S
N N
S
S
S
H
0.007 (0.180) M T L-M
S
N
S
C
E 0.004 (0.100) G G1 0.010 (0.250) S T L-M J -T-
SEATING PLANE
K1 K F VIEW S 0.007 (0.180)
M
VIEW S
S
T L-M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 ---
MECL Data DL122 -- Rev 6
2-11
MOTOROLA
MC10H171
OUTLINE DIMENSIONS
L SUFFIX CERAMIC DIP PACKAGE CASE 620-10 ISSUE V
9
-A-
16
-B-
1 8
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 --- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01
-T-
SEATING PLANE
N E F D G
16 PL
K M J
16 PL
0.25 (0.010)
M
M
TB
S
0.25 (0.010)
TA
S
-A-
16 9
P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R
B
1 8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
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JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 81-3-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA 2-12
MC10H171/D MECL Data DL122 -- Rev 6

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